FEBA provides after-sales technical service for all equipment with LCD, LED, MicroLED and TFT panel technology.
FEBA manages the repair, adjustment, calibration, full refurbishment processes of all mechanical devices in IT, bank equipment and retail equipment.
From SMD & BGA Component Level repair to full refurbishment, FEBA provides high-volume repair service for all electronic products to IPC 7711/7721 standards.
Setting out with an environmentally-concious approach, FEBA prevents electronic waste by renewing spare parts and products that are replaced after sales.
It is determined whether the fault in the module is a user error; accordingly, it is tested that the fault is caused by microLED or IC Parts.
It is the process of detecting and replacing defective ICs on the PCB.
It is the disassembly and assembly processes of defective microLEDs according to the technical profiles in the manufacturer's specifications or the profiles determined by FEBA.
In repairs to be made on the PCB, reballing is carried out on IC parts and MicroLEDs of all sizes.
RGB, heat and dark room tests are performed and the product is made ready for shipment in accordance with the determined packaging conditions.
6-months warranty is applied after all repair processes.
All repair processes are reported with the customer's criteria and presented at periodic times.
FEBA Elektronik repairs and replaces brand, model and size independent IC Drivers (TAB, COF and COG).
We replace defective LED, LGP (light guide plate) and optic layer with the new one.
The most common integrated circuit (IC) rework is TAB, COF and COG repair.
IC Driver breaking off or insufficient pasting causes horizontal or vertical lines on the screen.
As a result of breaking of ITO paths on the cell or falling into a short circuit, it is a technological repair method for repair.
FEBA supplies Opencell repair with its laser machine.
We test and detect defective parts on the PCB.
According to the specifications of the component, the disassembly and assembly process are carried out on the BGA rework station or solder station.
Reballing process is applied in order to eliminate the damages in the solder balls.
Final testing is done according to the manufacturer's specifications and packaged appropriately.